specdeviceinfo

t72hm

t72hm · Oysters

SoC
mt6572
RAM
1 GB PCDDR3
Resolution
1024x600
Android API
specdeviceinfo analysis

What this hardware actually means

Editorial interpretation generated from the device's self-reported fields and our SoC tier database. Cross-reference with the raw fields below; if you spot a contradiction, please tell us.

Platform & performance positioning

The oysters t72hm is built around the MT6572, a budget SoC from MediaTek. It launched in 2013 on a TSMC 28nm process. Dual-core ultra-budget SoC; the bottom rung of the early-2010s Android stack.

Legacy. Not usable for modern apps.

Day-to-day workload

1 GB PCDDR3 of RAM is insufficient for modern Android. Display resolution is 1024x600.

Trust & buying notes

If you're cross-checking a phone advertised as a oysters t72hm, the fields most worth verifying are: Build.MANUFACTURER lowercase-equal to "oysters"; Build.SOC_MODEL set (Android 12+) and consistent with MT6572. For an automated check, run our Hardware Trust Score from the DevCheck AI app and compare its output against this entry.

Identity

MANUFACTURER
oysters
BRAND
oysters
MODEL
t72hm

Operating System

PLATFORM
mt6572

SoC / CPU

CPU
MT8312C
CORES
2
FAMILY
Cortex-A7
CLOCK_SPEED
598 - 1300 MHz

GPU

GPU_VENDOR
ARM
GPU_MODEL
Mali-400 MP
GPU_CLOCK
299 - 500 MHz

Memory & Storage

RAM
1 GB PCDDR3
FLASH
NCard

Display

RESOLUTION
1024x600
TOUCHSCREEN
mtk-tpd

Sensors

ACCELEROMETER
BMA222
MAGNETOMETER
BMM056
ALSPS
RPR410

Audio & Power

CHARGER
USE PMIC

Other

LCM
tf070mc124_ips_dsi
CAMERA
gc2035_yuvgc2155_yuvgc2145_yuvsiv130b_yuvgc0328_yuvgc0308_yuvgc0329_yuvgc0311_yuvsiv121du_yuvgc0312_yuv
OTHER
kd_camera_hw
DevCheck AI · v1.0.4

Spot a refurbished, cloned, or emulated phone in 3 seconds.

DevCheck AI cross-checks 8 hardware signals on your Android device — CPU cores, ABI, SoC↔GPU vendor pairing, sensor presence, build fingerprint structure and more — and gives a single Hardware Trust Score.

  • Hardware Trust Score
  • Real Battery State-of-Health
  • SoC variant + big.LITTLE breakdown
  • Multi-source thermal monitoring